Intel's new Connected Logistics Platform (Intel CLP) may be the key to reducing package damage and loss in the transportation industry, at least the company thinks so.
According to Computer Business Review, the platform allows businesses to monitor the condition and location of products within the supply chain through low-cost IoT sensors. CLP will then use sensor tags, gateways and cloud components to monitor packages from loading to unloading.
At least 30 percent of all shipments are either damaged or delayed, according to the European Space Agency's Real-Time Intelligent Cargo Monitoring project. Adding to that, 30 percent of perishable goods go to waste during transport and never reach their destinations. If a single-use sensor tag is used, it can collect data points on location, temperature, humidity, shock, tilt and damage. For food products, the sensors will also inform businesses of the conditions the product is in while in transit.
CBR reports that the data that is gathered is sent to a gateway over a proprietary wireless sensor protocol. If a sensor is unable to communicate with the gateway due to a blocked single path, it will reroute through other sensors in its proximity through a secondary link.
"The Intel Connected Logistics Platform provides our clients a powerful solution across a range of different industry sectors for unprecedented real-time transparency of s hipment progress and conditions," JJ Van der Meer, partner at PA Consulting said in a statement. "Some evaluations include findings of temperature excusions for more than 60 percent of the shipment duration, with route and duration improvement opportunities of up to eight hours on a 36,hour shipment. They are also finding significant deviations in shock measurements, up to a doubling in g-forces experienced by sensitive products, depending on the truck and road quality."
